Siemens and Nvidia Automate Thermal Analyses in Chip Design

Electrothermal Simulation of 3D ICs Siemens and Nvidia Automate Thermal Analyses in Chip Design

2026-10-26 Source: Press release Celine Hummel | Translated by AI 2 min Reading Time

Related Vendors

tmts2026-ticec-banner-en-2000px (https://www.tmts.tw/en)

Taiwan Machine Tool & Accessory Builders' Association (TMBA)

SIMTOS (Seoul International Machine Tool Show)

With stacked chips, heat dissipation is becoming an increasing challenge. Siemens and Nvidia have therefore developed an AI-powered EDA workflow that automates electrical and thermal analyses. According to Siemens, this allows for the evaluation of up to 50 times more design variants.

Thermal simulation of a 3D IC visualizes the temperature distribution within the chip structure. Siemens and Nvidia aim to automate and accelerate such electrothermal analyses using AI-powered EDA workflows.(Image: Siemens EDA) — Thermal simulation of a 3D IC visualizes the temperature distribution within the chip structure. Siemens and Nvidia aim to automate and accelerate such electrothermal analyses using AI-powered EDA workflows.
(Image: Siemens EDA)

The more chiplets and semiconductor components are stacked on top of each other within a package, the more difficult it becomes to dissipate the resulting heat. Local temperature spikes can impair the performance and reliability of the components. Therefore, developers must take electrical and thermal interactions into account as early as the design phase of complex 3D-ICs.

To this end, Siemens Digital Industries Software, in collaboration with Nvidia, unveiled an AI-powered workflow on October 21, 2026, that automates these analyses across multiple EDA tools. Instead of manually preparing individual simulation steps, transferring data between programs, and repeatedly adjusting designs, AI agents take over the coordination of the tools.

Seven EDA Tools in a Single Workflow

The new approach integrates nine work steps across seven EDA tools from Siemens. These include, among others, mPower for power analysis, Calibre 3DThermal for thermal analysis, and Simcenter Flotherm for simulating thermal behavior at the system level. Other tools take into account, for example, temperature-dependent parasitic effects and the electrical behavior of the circuits.

The AI agents coordinate the analyses and assist in the search for suitable design variants. In this process, the engineer can modify, among other things, the component layout, material structures, power budgets, and thermal constraints. Evaluation continues to be performed using physics-based simulation tools. NVIDIA’s CUDA-X libraries accelerate parts of the calculations.

Up to 95 Percent Less Engineering Effort

According to Siemens, benchmark studies showed that engineering effort was reduced by up to 95 percent. Setting up the relevant tools took less than five minutes instead of several days. At the same time, up to 50 times more design variants could be analyzed than with conventional manual processes.

This is intended to help developers identify thermal bottlenecks earlier and compare different packaging and design options more systematically. This could simplify design optimization, particularly for 3D-ICs, where power consumption, heat generation, and package design are closely interrelated. The improvements mentioned are based on benchmark studies conducted by the manufacturer. The extent to which these time savings can be applied to specific development projects depends, among other factors, on the complexity of the design and the analysis tools used.

Subscribe to the newsletter now

Don't Miss out on Our Best Content

Business E-mail

Please enter a valid mailadress.

By clicking on „Subscribe to Newsletter“ I agree to the processing and use of my data according to the consent form (please expand for details) and accept the Terms of Use. For more information, please see our Privacy Policy. The consent declaration relates, among other things, to the sending of editorial newsletters by email and to data matching for marketing purposes with selected advertising partners (e.g., LinkedIn, Google, Meta).

Date: 08.12.2025

Naturally, we always handle your personal data responsibly. Any personal data we receive from you is processed in accordance with applicable data protection legislation. For detailed information please see our privacy policy.

Consent to the use of data for promotional purposes

I hereby consent to Vogel Communications Group GmbH & Co. KG, Max-Planck-Str. 7-9, 97082 Würzburg including any affiliated companies according to §§ 15 et seq. AktG (hereafter: Vogel Communications Group) using my e-mail address to send editorial newsletters. A list of all affiliated companies can be found here

Newsletter content may include all products and services of any companies mentioned above, including for example specialist journals and books, events and fairs as well as event-related products and services, print and digital media offers and services such as additional (editorial) newsletters, raffles, lead campaigns, market research both online and offline, specialist webportals and e-learning offers. In case my personal telephone number has also been collected, it may be used for offers of aforementioned products, for services of the companies mentioned above, and market research purposes.

Additionally, my consent also includes the processing of my email address and telephone number for data matching for marketing purposes with select advertising partners such as LinkedIn, Google, and Meta. For this, Vogel Communications Group may transmit said data in hashed form to the advertising partners who then use said data to determine whether I am also a member of the mentioned advertising partner portals. Vogel Communications Group uses this feature for the purposes of re-targeting (up-selling, cross-selling, and customer loyalty), generating so-called look-alike audiences for acquisition of new customers, and as basis for exclusion for on-going advertising campaigns. Further information can be found in section “data matching for marketing purposes”.

In case I access protected data on Internet portals of Vogel Communications Group including any affiliated companies according to §§ 15 et seq. AktG, I need to provide further data in order to register for the access to such content. In return for this free access to editorial content, my data may be used in accordance with this consent for the purposes stated here. This does not apply to data matching for marketing purposes.

Right of revocation

I understand that I can revoke my consent at will. My revocation does not change the lawfulness of data processing that was conducted based on my consent leading up to my revocation. One option to declare my revocation is to use the contact form found at https://contact.vogel.de. In case I no longer wish to receive certain newsletters, I have subscribed to, I can also click on the unsubscribe link included at the end of a newsletter. Further information regarding my right of revocation and the implementation of it as well as the consequences of my revocation can be found in the data protection declaration, section editorial newsletter.