Fuji Automatically Assembles a 1.3-kilogram Switch

SMT Assembly of Large Semiconductor Packages Fuji Automatically Assembles a 1.3-kilogram Switch

2026-10-26 Source: Press release Celine Hummel 2 min Reading Time

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In collaboration with Broadcom and Celestica, Fuji has tested the automated placement of the 1.3-kilogram (2.9-pound) Tomahawk 6—Davisson. According to the manufacturer, the NXTR placement machine was able to successfully place the CPO package onto a printed circuit board.

Weighing approximately 1.3 kg, the Tomahawk 6—Davisson combines an Ethernet switch ASIC with optical communication modules. Fuji has successfully evaluated the automated SMT assembly of the CPO package on an NXTR machine.(Image: Broadcom) — Weighing approximately 1.3 kg, the Tomahawk 6—Davisson combines an Ethernet switch ASIC with optical communication modules. Fuji has successfully evaluated the automated SMT assembly of the CPO package on an NXTR machine.
(Image: Broadcom)

As semiconductor packages continue to grow in size and weight, the demands on SMT assembly are also increasing. Machine manufacturer Fuji, in collaboration with Broadcom and electronics manufacturer Celestica, investigated the extent to which these components can be processed automatically. The focus was on the Tomahawk 6—Davisson Ethernet switch, which weighs approximately 1.3 kg. The component is based on Co-Packaged Optics (CPO) and integrates a switch ASIC with optical communication modules in a single package. The technology is designed for high-performance networks in AI data centers.

An NXTR placement machine from Fuji was used for the evaluation. According to the manufacturer, both transportability and placement accuracy were successfully demonstrated. However, Fuji does not provide specific measurement values for positioning accuracy or results regarding subsequent soldering.

Placement of Components Weighing Up to 2 kg

As early as EFX 2026, Fuji had demonstrated the processing of components measuring up to 200 × 200 mm (7.9 × 7.9 inches) and weighing 2 kg (4.4 pounds). The NXTR and AIMEXR machine platforms are designed to be capable of placing these components in their standard configurations. With the Broadcom Tomahawk 6—Davisson, there is now concrete proof of concept for a heavy CPO package.

While the placement on the NXTR was evaluated in practice, Fuji confirms the AIMEXR’s suitability for this component based on its design and technical specifications. With these enhancements, Fuji is responding to the increasing size and weight of high-performance semiconductor packages, which can only be processed with limited automation using conventional SMT methods.

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Link: More information about Fuji's NXTR placement platform

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