Thermal Management in Electronics Development Interdisciplinary Collaboration between Hardware Design and Engineering

Ever more compact, ever more powerful: The miniaturization of electronic assemblies pushes thermal management increasingly to its limits. Why successful heat dissipation can only be achieved through close integration of hardware design and engineering—and the role modern simulation tools play in this process.

The development of modern electronic systems has been characterized for years by two opposing trends: on the one hand, the continuous miniaturization of components, and on the other, the steadily increasing power density. This development inevitably leads to increased thermal stress within devices and systems. At the same time, the requirements for reliability, lifespan, and functionality under demanding environmental conditions are growing.