Arduino presents a new league of developer platforms with Arduino Ventuno Q: top performance and functionality for just under 300 US dollars: Not a bargain, but a new open-source, physical AI-capable dual-brain platform with Qualcomm's Dragonwing IQ 8 processor. A challenge to the Raspberry Pi.

Industry expert and IDEA analyst Marco Mezger provided an outlook for 2026 in February 2026, analyzing the developments in the semiconductor market: What challenges does the European electronics industry need to tackle? What developments are positive?

The AI infrastructure Contact Fourier AI combines AI technologies with engineering and manufacturing intelligence—for efficiency and speed in development, production and service. Sensitive engineering data remains with the user, while computationally intensive AI operations run in a secure cloud environment.

In 2025, China's automotive industry has aroused much admiration worldwide - and stirred up new fears. What will happen in 2026?

According to Speedpart, the printable plastic material Accura Xtreme Black can be used to meet the current requirements in additive manufacturing ...

Feindreh relies on modern Star sliding headstock automatic lathes and Knoll high-pressure systems for the smallest precision turned—for faster, safer processes and longer tool life.

A team from the Fraunhofer "HNFIZ" has published a newly developed evaluation model that classifies the technical capabilities of human-like robots across five expansion stages ...

As demand in the aerospace sector continues to grow, Moyola Precision Engineering has taken a step to expand its production capacity by investing in the first 5-axis horizontal machining centers (HMC) "AeroCell 160 | 400" from Bavius in the UK.

Modern high-performance data centers for computing generative AI applications rely on extremely energy-hungry chips that produce enormous amounts of waste heat. Conventional air cooling systems reach their limits here. Highly efficient liquid cooling systems that rely on robust miniature fluid control systems can meet the ever-increasing requirements. Lee has developed a valve that has been optimized for direct-to-chip cooling.

Compared to the deliveries of industrial robots, humanoid robots are light years behind. But that does not mean that they are not catching up at a rapid pace. The coming years will be decisive in this area.

AI agents on your own computer instead of in the cloud is becoming a mass phenomenon in China. The open source framework Openclaw is creating hype among tech enthusiasts and everyday users, and is raising new questions about the practical and safe use of AI.

Physical AI marks the transition from AI that primarily runs in data centers to intelligent systems that operate directly in the physical world. In technical terms, this involves machines that sense, think, act and communicate (STAC) with other systems, interpreting and reacting to their environment in real time.

While private players in the USA have already made the transition to industrial space production, Europe is at a crucial point: there is not so much a lack of technological expertise and innovative strength, but often a lack of consistency throughout the entire product life cycle.

Researchers at Texas A&M University have additively manufactured a superfoam that can absorb 10 times more energy than a conventional foam. This 3D-printed foam could have a significant impact in the defense sector and save lives.

Comau is presenting Mate-XT Go, a wearable exoskeleton designed to support employees in repetitive tasks and overhead work.

Modern test benches require more than classic power supply units. Dynamic load changes and increasing power densities demand high-precision, stable and reproducible AC and DC power sources. Integrated power supply systems are required that not only provide energy, but also reliably combine measurement, analysis and system integration.

Volkswagen Commercial Vehicles and enercity have launched a pilot project for bidirectional charging. Together, the companies want to show that electric vehicles can be efficiently integrated into the energy market.

Rolls-Royce has received 70 Million US dollars in funding from the EU public-private partnership "Joint Undertakings for Clean Aviation". This will help to lead the research project UNIFIED, short for "Ultra Novel and Innovative Fully Integrated Engine Demonstrations", which supports the development and planned ground tests of the UltraFan 30 demonstrator.

Bosch and Tata AutoComp Systems are planning a joint venture in India. It is all about e-drives for the country.

The car manufacturer is expanding its involvement in motorsport. Starting next season, Opel will participate in Formula E—with the new Gen4 racing car.

Researchers have developed a new type of component to transmit data quickly and reliably. The electro-optical modulator transmits data through fiber optic cables and can be produced in large quantities at low cost.

Dualis and Montratec have developed a configuration tool based on Visual Components that simplifies the planning of production and material flow layouts. The solution is aimed in particular at production environments with a high degree of automation.

Electronic devices are becoming smaller, more compact and more sophisticated. 3D printing offers a viable alternative to traditional manufacturing processes. Jake Collins from Boston Micro Fabrication shows the advantages of high-precision 3D printing for the development and production of electronic components and what companies should look out for.

LOPEC 2026 shows the increasing industrialization of printed electronics: With concrete applications and positive market signals, the technology is developing from a research topic to an industrial component that is also increasingly being discussed in safety-critical applications.