Advanced Packaging
China's Investment Boom in Advanced Packaging

By Henrik Bork | Translated by AI 5 min Reading Time

Related Vendor

Nearly ten major projects: China's advanced packaging industry is massively expanding its capacity. The driving force behind this is the demand for chips used in AI and high-performance computing.

Next-generation packaging and testing solutions for high-density 3D power modules from JCET.(Image: JCET)
Next-generation packaging and testing solutions for high-density 3D power modules from JCET.
(Image: JCET)

China's advanced packaging industry is experiencing a new wave of capacity expansion. Between May and July 2026, nearly ten major projects were announced, with total investments of approximately 40 billion yuan (just under five billion euros / $5.8 billion), according to the technology portal Pandaily.