Foxconn, Thales, And Radiall Evaluate FOWL Packaging in France

Packaging Partnership Foxconn, Thales and Radiall Evaluate FOWL Packaging in France

2025-06-03 From Susanne Braun | Translated by AI 2 min Reading Time

Related Vendors

Fan-Out Wafer-Level Packaging (FOWLP) allows for particularly compact design, high performance, and improved thermal properties for semiconductor chip enclosures. Foxconn aims to partner with Thales and Radiall to bring such a facility to France.

Thales, Foxconn, and Radiall intend to cooperate for Fan-Out Wafer-Level Packaging.(Image: Thales) — Thales, Foxconn, and Radiall intend to cooperate for Fan-Out Wafer-Level Packaging.
(Image: Thales)

In mid-May 2025, the Choose France Forum was held for the eighth time in France. Among those who accepted the invitation to the Choose France economic summit, extended by French President Emmanuel Macron, was the electronics manufacturing company Foxconn (Hon Hai Technology Group), which took the opportunity to announce the evaluation of a partnership. Together with the French defense company Thales and the connectivity specialist Radiall, they plan to discuss the establishment of a site in France.

The partners have in mind a facility for Fan-Out Wafer-Level Packaging (FOWLP). With the announced facility, Foxconn would establish the first dedicated Fan-Out Wafer-Level Packaging manufacturing plant in France and across the EU at this volume level. Although there are pilot lines and smaller production capacities in Europe, an industrialized facility has been lacking; the capacities are mainly in Asia so far. This, of course, aligns with the EU's plans to promote semiconductor manufacturing in the region.

"In the event of a successful completion, the facility would target the European markets for aerospace, automotive, space, telecommunications, and advanced packaging in the defense sector while also bringing together other European industrial investors," Foxconn states.

Fan-Out Wafer-Level Packaging

Fan-Out Wafer Level Packaging (FOWLP) is an advanced process in semiconductor manufacturing that enables a more compact, powerful, and flexible packaging technology. Unlike traditional wafer-level packaging methods, where the electrical contacts are only on the original chip area ("Fan-In"), FOWLP allows these contacts to be extended beyond the edges of the chip.

The process begins with the singulation of the chips, meaning before they are integrated into a package. These individual chips are then embedded in a carrier material, such as plastic or special resins. This creates a so-called reconstructed wafer, which is larger than the original silicon wafer. Redistribution Layers (RDL) are then applied to this surface—fine conductive traces that relocate the contacts of the chip outward, creating the "Fan-Out" effect. (sb)

Subscribe to the newsletter now

Don't Miss out on Our Best Content

Business E-mail

Please enter a valid mailadress.

By clicking on „Subscribe to Newsletter“ I agree to the processing and use of my data according to the consent form (please expand for details) and accept the Terms of Use. For more information, please see our Privacy Policy. The consent declaration relates, among other things, to the sending of editorial newsletters by email and to data matching for marketing purposes with selected advertising partners (e.g., LinkedIn, Google, Meta)

Date: 08.12.2025

Naturally, we always handle your personal data responsibly. Any personal data we receive from you is processed in accordance with applicable data protection legislation. For detailed information please see our privacy policy.

Consent to the use of data for promotional purposes

I hereby consent to Vogel Communications Group GmbH & Co. KG, Max-Planck-Str. 7-9, 97082 Würzburg including any affiliated companies according to §§ 15 et seq. AktG (hereafter: Vogel Communications Group) using my e-mail address to send editorial newsletters. A list of all affiliated companies can be found here

Newsletter content may include all products and services of any companies mentioned above, including for example specialist journals and books, events and fairs as well as event-related products and services, print and digital media offers and services such as additional (editorial) newsletters, raffles, lead campaigns, market research both online and offline, specialist webportals and e-learning offers. In case my personal telephone number has also been collected, it may be used for offers of aforementioned products, for services of the companies mentioned above, and market research purposes.

Additionally, my consent also includes the processing of my email address and telephone number for data matching for marketing purposes with select advertising partners such as LinkedIn, Google, and Meta. For this, Vogel Communications Group may transmit said data in hashed form to the advertising partners who then use said data to determine whether I am also a member of the mentioned advertising partner portals. Vogel Communications Group uses this feature for the purposes of re-targeting (up-selling, cross-selling, and customer loyalty), generating so-called look-alike audiences for acquisition of new customers, and as basis for exclusion for on-going advertising campaigns. Further information can be found in section “data matching for marketing purposes”.

In case I access protected data on Internet portals of Vogel Communications Group including any affiliated companies according to §§ 15 et seq. AktG, I need to provide further data in order to register for the access to such content. In return for this free access to editorial content, my data may be used in accordance with this consent for the purposes stated here. This does not apply to data matching for marketing purposes.

Right of revocation

I understand that I can revoke my consent at will. My revocation does not change the lawfulness of data processing that was conducted based on my consent leading up to my revocation. One option to declare my revocation is to use the contact form found at https://contact.vogel.de. In case I no longer wish to receive certain newsletters, I have subscribed to, I can also click on the unsubscribe link included at the end of a newsletter. Further information regarding my right of revocation and the implementation of it as well as the consequences of my revocation can be found in the data protection declaration, section editorial newsletter.