Valeo and Calyos develop cooling systems for car chips

Two-Phase Cooling System Valeo and Calyos develop cooling systems for car chips

2026-06-22 From Berit Klotz | Translated by AI 1 min Reading Time

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To protect high-performance chips in software-defined vehicles from overheating, Valeo and Calyos are joining forces. The partners are developing a maintenance-free, passive cooling technology that operates without pumps.

In the picture: from right to left, Pascale Herman, Christophe Delhovren, Antoine de Ryckel, Olivier de Laet. They intend to work together in the future.(Image: Valeo) — In the picture: from right to left, Pascale Herman, Christophe Delhovren, Antoine de Ryckel, Olivier de Laet. They intend to work together in the future.
(Image: Valeo)

The automotive supplier Valeo and the Belgian specialist Calyos have now signed a Memorandum of Understanding (MoU) to jointly bring a completely new generation of cooling systems to market maturity. According to the companies, the focus of the collaboration is on passive "Loop-Heat-Pipe" two-phase cooling systems (LHP). The goal is compact, standalone, and maintenance-free cooling systems that can dissipate high thermal loads without the use of active components such as pumps.

Control Units and Charging Technology in Focus

According to Valeo, the system promises significant advantages for the automotive industry: the autonomous cooling is expected to be used in on-board chargers (OBC), inverters, and integrated "x-in-1" power electronics. As a compact "plug-and-play" system, it simplifies the vehicle cooling architecture and enables additional energy savings—particularly for electronic components in the rear area of the vehicle.

VW is developing a new E/E architecture for its future Chinese models. Experts say that the technology in this area is developing faster than the organizations. (Image:Volkswagen AG)

With a view toward modern SDV (Software-Defined Vehicle) architectures, which increasingly rely on centralized high-performance computers, this technology offers an independent heat dissipation solution. The major advantage is clear: automakers could potentially eliminate the need for complex liquid cooling circuits distributed throughout the entire vehicle.

From the Car to the AI Data Center

Beyond mobility, the partners have their sights set on another massive market: data centers. Driven by the explosive growth of Artificial Intelligence (AI), traditional air-cooled server racks are rapidly reaching their thermal limits. At the same time, operators are under immense pressure to reduce the massive global energy consumption of these data centers.

Valeo and Calyos aim to tackle this issue with a two-phase cooling solution for semiconductors. According to the partners, these self-contained units can be mounted directly onto the processors (direct-to-chip cooling) and utilized for each individual server within a rack. This allows data centers to significantly increase the power density of their existing air-cooled infrastructure—without the need for fundamental and expensive retrofitting.

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