Image Processing Teledyne e2v Introduces Image Sensors with Global Shutter and Back-Illuminated Design

By Manuel Christa | Translated by AI 2 min Reading Time

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Teledyne e2v is expanding its sensor portfolio with the Nexora family. These CMOS image sensors combine back-illuminated technology with a global shutter and are designed for applications such as industrial image processing, transportation technology, and surveillance.

The new Nexora sensor family from Teledyne e2v: These CMOS image sensors combine BSI technology with a global shutter and are available in 12- and 16-megapixel versions.(Image: Teledyne)
The new Nexora sensor family from Teledyne e2v: These CMOS image sensors combine BSI technology with a global shutter and are available in 12- and 16-megapixel versions.
(Image: Teledyne)

The Nexora sensors use backside illumination (BSI) technology and are initially available in 12- and 16-megapixel versions. The manufacturer offers both versions in both black-and-white and color.

The 12-megapixel model has a resolution of 4,096 × 3,072 pixels, while the 16-megapixel version has a resolution of 4,096 × 4,096 pixels. With this platform, Teledyne e2v is targeting applications that require high-resolution images with short exposure times. The company cites industrial image processing, intelligent transportation systems, and outdoor surveillance as examples.

BSI Aims to Increase Luminous Efficiency

In the BSI architecture, the light-sensitive structure is located closer to the back of the chip, where the light strikes the sensor. This means that, unlike in classic front-side-illuminated sensors, wires and other circuit elements no longer lie between the light source and the photodiode. As a result, a larger proportion of the incident radiation can be utilized.

Teledyne e2v specifies a quantum efficiency of up to 73 percent for Nexora at a wavelength of 550 nanometers. At 940 nanometers in the near-infrared range, quantum efficiency is said to reach up to 15 percent. With this, the manufacturer is targeting applications with challenging lighting conditions as well as systems that detect radiation outside the visible spectrum.

The sensors also use a 3D stacked architecture. In this design, Teledyne e2v distributes different functions across multiple semiconductor layers stacked on top of one another. This is intended to provide more flexibility in integration and help create more compact cameras.

LVDS Interface for FPGAs and Image Processors

Nexora uses an LVDS interface for data transmission. It is designed to enable connection to various FPGAs and image signal processors. The sensors are housed in a 23 × 21.5-millimeter (0.91 × 0.85-inch) enclosure and, according to the manufacturer, can be used in cameras with a 29 × 29-millimeter (1.14 × 1.14-inch) footprint. Standard C-mount lenses are also supported.

With a global shutter, all pixels in an image capture the exposure period simultaneously. This prevents geometric distortions, such as those that can occur with rolling-shutter sensors when imaging fast-moving objects. This feature is particularly important for industrial inspection tasks, moving workpieces, or traffic scenes.

Teledyne e2v plans to showcase the Nexora sensors at Vision in Stuttgart (Germany) from October 6 to 8, 2026. According to the company, documentation and samples are available upon request. 

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