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New approach for EUV lithography: More efficient and cheaper than ASML's standard

On the left is the standard model currently used in the industry. On the right is the OIST model. The innovation stands out due to its significantly better stability and ease of maintenance, as it only requires two mirrors and a light source of just 20 W, which reduces the overall power consumption of the system to less than 100 kW - a tenth compared to conventional technologies, which often require more than 1 MW (= 1,000 kW) for operation. The new system maintains a very high contrast and at the same time reduces the 3D effects of the mask by achieving the nanometer precision required for the exact transfer of the logical patterns from the photomask to the silicon wafer. (Image:OIST /Tsumoru Shintake) arrow forward Image Zoom
On the left is the standard model currently used in the industry. On the right is the OIST model. The innovation stands out due to its significantly better stability and ease of maintenance, as it only requires two mirrors and a light source of just 20 W, which reduces the overall power consumption of the system to less than 100 kW - a tenth compared to conventional technologies, which often require more than 1 MW (= 1,000 kW) for operation. The new system maintains a very high contrast and at the same time reduces the 3D effects of the mask by achieving the nanometer precision required for the exact transfer of the logical patterns from the photomask to the silicon wafer. (Image: OIST /Tsumoru Shintake)
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