Cadence And Samsung Foundry Expand 2nm And 3D IC Cooperation

Semiconductor Development Cadence And Samsung Foundry Expand 2nm And 3D IC Cooperation

2026-06-02 From Sebastian Gerstl 2 min Reading Time

Related Vendors

tmts2026-ticec-banner-en-2000px (https://www.tmts.tw/en)

Taiwan Machine Tool & Accessory Builders' Association (TMBA)

SIMTOS (Seoul International Machine Tool Show)

Cadence and Samsung Foundry are expanding their collaboration for 2nm and 3D IC designs. The goal is a signoff-capable platform for AI, HPC and edge chips.

Cadence and Samsung Foundry have developed a portfolio of memory and interface IP and expanded the certification of Cadence design and analysis flows for agentic AI, digital circuits, custom circuits, 3D ICs and system design (SDA) for Samsung Foundry's second-generation 2nm process.(Image: Samsung Foundry) — Cadence and Samsung Foundry have developed a portfolio of memory and interface IP and expanded the certification of Cadence design and analysis flows for agentic AI, digital circuits, custom circuits, 3D ICs and system design (SDA) for Samsung Foundry's second-generation 2nm process.
(Image: Samsung Foundry)

Cadence and Samsung Foundry have announced a multi-year expansion of their collaboration. The focus is on an expanded portfolio for memory and interface IP as well as certified design flows for Samsung's second-generation 2nm process technology. The platform is intended to support developers of AI infrastructure, HPC systems, edge AI chips and physical AI applications.

The agreement follows on from the certification of Cadence tools and IP for several Samsung Foundry nodes announced in 2025. New is the broader coverage of high-speed SerDes, PCIe, UCIe, leading memory interfaces and NVIDIA NVLink C2C-capable interconnects. CUDA-X GPU-accelerated libraries are also part of the expanded range.

Certified Flows for 2 nm Designs

Cadence provides a comprehensive, certified flow for Samsung's second 2nm generation. This includes Innovus for digital implementation, Virtuoso Studio for analog and custom designs, the Integrity 3D-IC Platform for system design and implementation, and Voltus for power integration and system power analysis. Quantus and Tempus complete the flow for extraction and timing signoff.

The flow is enhanced by glitch power optimization in Genus and Innovus as well as a smart hierarchical approach for place-and-route. This is intended to help developers achieve better results in terms of performance, power and area for large AI and HPC designs, while at the same time shortening the lead time to tapeout.

Samsung's 3D Cube H technology is also included in the collaboration. For Hybrid Copper Bonding, the flow includes system planning, implementation, analysis, verification and signoff. Among others, Cadence Cerebrus, Integrity 3D-IC, Innovus, Voltus and Pegasus are involved. Automated routing and optimization for silicon interposers are also included.

Cadence and Samsung Foundry plan to showcase the expanded collaboration at the Samsung Advanced Foundry Ecosystem Event SAFE 2026. Technical sessions and demonstrations on 2nm and 3D IC flows for GPU-accelerated AI workloads are planned. For chip developers, the announcement is particularly relevant because it promises a more integrated environment of foundry process, IP, EDA tools and signoff for complex AI designs. (sg)

Subscribe to the newsletter now

Don't Miss out on Our Best Content

Business E-mail

Please enter a valid mailadress.

By clicking on „Subscribe to Newsletter“ I agree to the processing and use of my data according to the consent form (please expand for details) and accept the Terms of Use. For more information, please see our Privacy Policy. The consent declaration relates, among other things, to the sending of editorial newsletters by email and to data matching for marketing purposes with selected advertising partners (e.g., LinkedIn, Google, Meta)

Date: 08.12.2025

Naturally, we always handle your personal data responsibly. Any personal data we receive from you is processed in accordance with applicable data protection legislation. For detailed information please see our privacy policy.

Consent to the use of data for promotional purposes

I hereby consent to Vogel Communications Group GmbH & Co. KG, Max-Planck-Str. 7-9, 97082 Würzburg including any affiliated companies according to §§ 15 et seq. AktG (hereafter: Vogel Communications Group) using my e-mail address to send editorial newsletters. A list of all affiliated companies can be found here

Newsletter content may include all products and services of any companies mentioned above, including for example specialist journals and books, events and fairs as well as event-related products and services, print and digital media offers and services such as additional (editorial) newsletters, raffles, lead campaigns, market research both online and offline, specialist webportals and e-learning offers. In case my personal telephone number has also been collected, it may be used for offers of aforementioned products, for services of the companies mentioned above, and market research purposes.

Additionally, my consent also includes the processing of my email address and telephone number for data matching for marketing purposes with select advertising partners such as LinkedIn, Google, and Meta. For this, Vogel Communications Group may transmit said data in hashed form to the advertising partners who then use said data to determine whether I am also a member of the mentioned advertising partner portals. Vogel Communications Group uses this feature for the purposes of re-targeting (up-selling, cross-selling, and customer loyalty), generating so-called look-alike audiences for acquisition of new customers, and as basis for exclusion for on-going advertising campaigns. Further information can be found in section “data matching for marketing purposes”.

In case I access protected data on Internet portals of Vogel Communications Group including any affiliated companies according to §§ 15 et seq. AktG, I need to provide further data in order to register for the access to such content. In return for this free access to editorial content, my data may be used in accordance with this consent for the purposes stated here. This does not apply to data matching for marketing purposes.

Right of revocation

I understand that I can revoke my consent at will. My revocation does not change the lawfulness of data processing that was conducted based on my consent leading up to my revocation. One option to declare my revocation is to use the contact form found at https://contact.vogel.de. In case I no longer wish to receive certain newsletters, I have subscribed to, I can also click on the unsubscribe link included at the end of a newsletter. Further information regarding my right of revocation and the implementation of it as well as the consequences of my revocation can be found in the data protection declaration, section editorial newsletter.