Wolfspeed Announces Production of a Single-Crystal 300-mm SiC Wafer

Power Semiconductors Wolfspeed Announces Production of a Single-Crystal 300-mm SiC Wafer

2026-01-15 From Susanne Braun | Translated by AI 1 min Reading Time

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Semiconductors made of silicon carbide (SiC) are sought-after components for high-performance applications in AI and high-current sectors due to their properties. With a breakthrough in single-crystal 300-mm SiC wafers (12 inches), Wolfspeed aims for greater cost efficiency in production.

Wolfspeed has produced a single-crystal 300-mm silicon carbide wafer.(Image: Wolfspeed) — Wolfspeed has produced a single-crystal 300-mm silicon carbide wafer.
(Image: Wolfspeed)

The US semiconductor manufacturer Wolfspeed, which has recently been making headlines more for economic than technological news, reported a milestone on January 13, 2026. For the first time, a single-crystal silicon carbide wafer in the 300 mm format was successfully produced. This format (12 inches) is larger than the previously common 200 mm SiC wafers and is considered crucial for the industrial scaling of this technology.

The expansion to 300 mm aims to significantly improve the manufacturability and cost-efficiency of SiC components. Larger wafers mean more chips per production run and thus lower unit costs, which can increase the widespread use of SiC in high-performance systems, such as data center infrastructures for AI, AR/VR platforms, or high-quality power components.

"The production of a 300-mm single-crystal silicon carbide wafer is a significant technological achievement and the result of years of focused innovations in crystal growth, boule, and wafer processing," said Elif Balkas, Chief Technology Officer of Wolfspeed. "This enables Wolfspeed to support the industry's most transformative technologies, particularly critical elements of the AI ecosystem, immersive augmented and virtual reality systems, as well as other advanced applications for power devices." (sb)

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