The Embedded Industry Meeting embedded world 2024 - Highlights of the Exhibition
nVent Schroff shows you in Hall 1, Stand 211 modular solutions for Advanced Computing. The RatiopacPRO Style platform enables a flexible design of measuring and testing devices or laboratory instruments. In addition, custom cooling solutions are developed and presented to optimize heat management in total systems. A new backplane from nVent SCHROFF enables higher data rates and supports the current standard up to PCI Express Gen4. (Image: Bild:) 15/25 Back to the Article