More Powerful Ion Trap

A Novel Laser Amplifier Gives Quantum Computers a Boost

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These Challenges Must be Overcome:

The development presents the research team with significant technical challenges. The glass package must be hermetically sealed to protect the sensitive semiconductor laser from environmental influences. To achieve this, the IZM is developing a special vacuum-based welding process. At the same time, the system requires sophisticated thermal management. Through metallized through-glass vias (TGVs), the resulting waste heat must be effectively dissipated. The researchers are also breaking new ground in integrating optical components. A reflective window is directly integrated into the package, eliminating the need for adhesives and thus avoiding potential outgassing. Instead, joining technologies are employed that can withstand the forces associated with vacuum methods.

(The project is funded by the Federal Ministry for Research, Technology and Space (BMFTR) within the funding measure "Enabling Technologies for Resilient R&D Supply Chains in Quantum Technologies" under the funding code 13N17477).

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