Encapsulated Connection

Microcapsules Optimize Reliable Bonding at the Push of a Button

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Now Partners Are Being Sought for the Practical Implementation of the New Way of Bonding

The approach is now set to be transferred into concrete applications. For this, the IAP is seeking partners from industry and research who can contribute their own components, carrier materials, or assembly processes. Companies looking to simplify large-area joining processes, make adhesive handling safer, or better integrate the bonding process into existing assembly workflows are particularly relevant. Together, it can be evaluated whether the capsule and carrier system can be adapted to specific requirements and what material quantities would be needed for application-oriented tests. If a partner brings along a suitable use case, the Fraunhofer IAP will tailor the capsule and carrier system specifically for that application, as emphasized by the team in Potsdam. In the synthesis pilot plant of the Fraunhofer Pilot Plant Center for Polymer Synthesis and Processing (PAZ) at the Fraunhofer IAP, microcapsules can also be produced on a ton scale. This ensures that sufficient material quantities are available to test this type of bonding under application-oriented conditions.

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