Fraunhofer IMWS: Lightweight Construction & Thermal Management for Electric Cars

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Innovative Encapsulants for Electronic Components

For the implementation of the electronics, novel inorganic potting compounds were evaluated in terms of their thermal conductivity, weight, and reliability. To this end, processing concepts were developed for use in printed-circuit board-based electronic assemblies and for integration into lightweight structural elements, the report continues. New preparation and diagnostic methods for failure analysis were also implemented. Custom-built functional prototypes were evaluated with regard to reliability risks and aging mechanisms for electronic components using novel encapsulation materials. To this end, high-resolution analyses for microstructure characterization (ion beam techniques, SEM, EDX) as well as targeted thermal cycling tests were conducted. In addition, surface insulation resistance (SIR) tests, thermal shock tests, and passive moisture-heat tests were conducted to track the material reactions taking place and analyze degradation mechanisms.

This work was complemented by concepts for integrated data collection and data-driven quality assurance, in which parameters—such as those from the injection molding machine, the infrared oven, and the robotic gripping system—were combined and made fully automatically available to specific user roles (such as setup technicians, injection molders, and project managers). This provides particularly deep insights into the relationships between process parameters and product properties.

Gallery

This is what it looks like when the preheated organic sheets for the lightweight sandwich component are placed into the injection mold by the robotic gripper. The injection molding machine itself is manufactured by Engel Austria.(Image: Fraunhofer IMWS)

Cross-section of the sandwich component, clearly showing the foam core produced using the TSG process.(Image: Fraunhofer IMWS)

The sandwich component as seen in the real-world view.(Image: Fraunhofer IMWS)

Prototype with a selected new inorganic encapsulant for electronics.(Image: Fraunhofer IMWS)

Gallery with 5 images

Bring on the Next Generation of E-Mobility

It can therefore be said that the partners have developed viable concepts for the integration of high-performance electronics into plastic components, for alternative housing systems, and for the thermal optimization of potted systems. It is particularly valuable that materials development, process engineering, simulation, testing technology, and data analysis could be brought together in a joint development approach. The project results thus open up a wide range of application possibilities—particularly when it comes to lightweight structural components with integrated electronics and thermal management functions in the automotive sector. This provides important impetus for the next generation of resource-efficient, high-performance, and—last but not least—industrially viable vehicle components, which is likely to be particularly relevant for the field of e-mobility, as the report concludes.

Contents of the article:

Page 1: Lightweight Construction System Offers Key Additional Features for E-Mobility
Page 2: Innovative Encapsulants for Electronic Components

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Date: 08.12.2025

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