For Better Contacts

Special Plasma Cleans Copper and Silver Surfaces

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This Is What Plasma Treatment of Copper and Silver Brings to the Industry:

The process is therefore of particular interest for industrial applications where clean and functional metal surfaces are a prerequisite for reliable soldering, bonding, and contacting processes of all kinds. This includes, in particular, circuit board manufacturing (e.g., metal core printed circuit boards), power electronics, so-called leadframe production, and other semiconductor processes. Potential users include manufacturers and suppliers of electronic assemblies, circuit carriers, contact components, and connection systems. Since the process operates under atmospheric pressure and requires neither vacuum infrastructure nor chemical etching agents, it offers significant potential for more resource-efficient and inline-compatible production processes, it is stated. In the future, this approach could be extended to other metallic systems (e.g., tin), where oxide formation generally impairs the reliability of connections as well.

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