TSMC Will Separate from the Production of GaN Wafers by July 2027

Power Electronics TSMC Will Separate from the Production of GaN Wafers by July 2027

2025-07-07 From Susanne Braun Susanne Braun | Translated by AI 1 min Reading Time

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Semiconductor manufacturer Navitas announces its future cooperation with PSMC for the production of GaN power ICs. The previous partner TSMC, on the other hand, plans to discontinue GaN wafer production. It is said that the existing infrastructure for advanced packaging will be used for AI tech.

TSMC will reportedly discontinue the production of 200-mm GaN wafers by July 2027.(Image: TSMC) — TSMC will reportedly discontinue the production of 200-mm GaN wafers by July 2027.
(Image: TSMC)

Strategic decisions have been made at TSMC to focus on the development of advanced process nodes to meet the growing demand for products implementing artificial intelligence. This is reflected, among other things, in the discontinuation of wafer services for gallium nitride (GaN) by July 31, 2027.

This can be taken from a press release by previous GaN partner Navitas, which states: "The 100-V family is expected to go into production at Powerchip in the first half of 26, while the company expects the 650-V components to transition from Navitas' previous supplier TSMC to Powerchip within the next 12 to 24 months." Accordingly, Powerchip Semiconductor Manufacturing Corporation (PSMC) is now the new partner to continue the production and development of the 200-mm GaN-on-Silicon technology. The first qualifications are planned for the fourth quarter of 2025, with mass production of 100-V GaN products starting from the first half of the year 2026.

Rumor has it that the GaN-on-Silicon technology from PSMC was chosen because TSMC subsidiary Vanguard International Semiconductor (VIS) uses the more complex and expensive GaN-on-QST technology (Qromis Substrate). For cost-sensitive applications, GaN-on-Si is still the preferred choice.

Industry insiders assume that TSMC is withdrawing from GaN wafer production primarily due to increasing competition from China and the associated margin pressure. Additionally, the Hsinchu Fab 5, which was previously used for GaN technology, could soon be repurposed for Advanced Packaging (via TrendForce). By reutilizing existing cleanroom facilities, TSMC can accelerate expansion with minimal effort as the demand for CoWoS, Wafer-on-Wafer (WoW), and Wafer-Level System Integration (WLSI) technologies increases. (sb)

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Date: 08.12.2025

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