Imec Automotive Chiplet Program (ACP) Alliance for the Introduction of Chiplets in the Automotive Industry

From Sebastian Gerstl | Translated by AI 1 min Reading Time

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With Globalfoundries, Infineon, Silicon Box, STATS ChipPAC, and other Tier-IV suppliers, the first foundry and leading companies in the automotive supply chain have joined Imec's Automotive Chiplet Program (ACP). The goal is to establish a stable European supply chain for the introduction of chiplets into the automotive industry.

Image from the public presentation of the imec automotive ecosystem at the "2025 Spring Automotive Chiplet Forum" in Cambridge.(Image: imec)
Image from the public presentation of the imec automotive ecosystem at the "2025 Spring Automotive Chiplet Forum" in Cambridge.
(Image: imec)

Imec has gained another partner for its Automotive Chiplet Program (ACP) with Globalfoundries. Infineon, Silicon Box, STATS ChipPAC, and TIER IV have also joined the program, which focuses on developing scalable, chiplet-based architectures for future vehicle platforms.

The background is the increasing complexity of modern vehicles, particularly due to ADAS, autonomous driving functions, and software-defined architectures. Chiplets are considered a promising approach to flexibly scale computing power while meeting requirements for reliability and functional safety.

As a foundry partner, Globalfoundries brings manufacturing capacities in the USA, Europe, and Asia, as well as proven automotive technologies. Within the framework of the ACP, Imec is working with industry partners on reference architectures, interconnect standards, and new approaches to the qualification of chiplet systems.

Imec's Automotive Chiplet Program (ACP) was launched in May with 20 supporters and is seeing growing interest. The goal is to jointly define standards for interposers, protocols, form factors, and diagnostic tools – taking future certification requirements beyond existing standards like AEC-Q100 into account. (sg)

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