Initiative CHASSIS for Chiplet Technology in the Automotive Sector

Software-Defined Mobility Initiative CHASSIS for Chiplet Technology in the Automotive Sector

2025-12-30 From Stefanie Eckardt | Translated by AI 1 min Reading Time

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To make software-defined mobility a reality, Arteris, Axelera AI, BMW, Bosch, CEA, Chips-IT, Fraunhofer, Imec, Infineon, Menta, NXP, Renault/Ampere, Stellantis-CRF, Siemens, Tenstorrent, TTTech Auto, and Valeo have joined forces in the initiative "Chiplet-based Hardware Architectures for Software-defined Vehicles."

The illustrated automotive SoC model utilizes modular chiplets and showcases a future where adaptable designs offer customization, scalability, and faster innovation cycles.(Image: Imec) — The illustrated automotive SoC model utilizes modular chiplets and showcases a future where adaptable designs offer customization, scalability, and faster innovation cycles.
(Image: Imec)

The initiative "Chiplet-based Hardware Architectures for Software-defined Vehicles," or CHASSIS for short, aims to bring together companies from Europe's mobility, semiconductor, and software sectors with research institutions to advance the development, standardization, and industrialization of chiplet technology for software-defined mobility. The research program has a duration of three years and is supported by the Chips Joint Undertaking and its members, including additional funding from France, Germany, the Netherlands, and the United Kingdom.

Chiplets As An Alternative to Single-Chip Approaches

With a steadily increasing share of software in vehicles, the demands for computing power and flexibility are rising. Traditional monolithic SoC concepts are reaching technical limits, as integrating many functions onto a single component makes development more complex and expensive. A solution to this challenge lies in chiplets—a modular alternative to single-chip approaches. Chiplets distribute computing tasks across multiple specialized chips that can be combined as needed. Thanks to their modular design, vehicle electronics can be tailored to functional requirements—without being constrained by hardware limitations.

Standardized Interfaces And Architectures

The full potential of chiplet technology can only be unlocked with standardized interfaces and chiplet architectures. This is precisely where a collaborative approach like CHASSIS comes into play: the initiative plans to develop an open chiplet-based platform specifically designed for use in vehicles. This platform is intended to be flexible, scalable, and expandable to meet the demands of future vehicle generations. This approach opens the market to additional suppliers, strengthening the competition for high-performance computing both technologically and economically. "The goals of CHASSIS can only be achieved through the joint commitment of all partners. In the long term, the entire global automotive industry will benefit from an open chiplet ecosystem," explains Thomas Schamm, spokesperson for CHASSIS project coordinator Bosch. (se)

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Date: 08.12.2025

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