Additive manufacturing in electronics Electronics housings and PCBs from the 3D printer

Related Vendors

Xometry Europe GmbH

FAULHABER Drive Systems

Wuxi InfiMotion Technology Co., Ltd.

Develop prototypes of electronics housings and PCBs faster and with less waste: 3D printing can accelerate and improve the development process. This ranges from flexible manufacturing possibilities to shortened development times.

*Niko Mroncz is Head of Sales Engineering at Xometry Europe.

 

The use of additive manufacturing techniques significantly accelerates development and production processes in electronics. Particularly attractive is the ability to combine different materials in a single printing process. As 3D printing becomes increasingly easier to apply, the time for prototyping is noticeably reduced. Overall, additive technologies reduce lead times, costs, and error rates in production.

3D printing will transform supply chains for electronic components, especially in combination with on-demand production. At the heart of this development are digital manufacturing platforms like Xometry Europe. On this digital marketplace, orders for the production of components are allocated to suitable producers in the shortest possible time. Developers can choose from hundreds of materials and dozens of technologies. This enables the production of electronic components with fixed delivery times and a limited cost structure. Manufacturers can respond directly to customer inquiries.

Electronics housings and PCBs with 3D printing

The possibilities for more innovation through 3D printing are already evident in development. Developers have much more freedom for new ideas and no longer have to rely on the same hardware designs. SLS (Selective Laser Sintering) and MJF (Multi Jet Fusion) are suitable for complex constructions as well as for series production. Compared to conventional methods, additive manufacturing allows for much faster production of larger quantities of electronic housings, circuit boards, and other components.

With 3D printing for solar modules, for example, developers can break conventional rules. This applies not only to the outer structure but also to the inner circuits. The performance of the components is improved, size and weight are reduced, and at the same time, complex and precise geometries can be realized.

Print built-in circuit together with the component

A 3D model is completely generated and printed on the computer, leaving little room for errors. In conventional production methods, the circuit is added at a later stage. In additive manufacturing, however, the built-in circuit is printed along with the component. It is thus encapsulated, protecting it from external damage. For example, the small antenna of a mobile phone can be printed directly into the phone.

Unlike conventional methods, circuit boards can also be printed on non-flat surfaces. This allows electronics to be embedded in wearables, sensors on flexible surfaces, glucose test strips, prosthetics, or customizable batteries. Such tailored devices and printed batteries can outperform conventional devices. After all, their shape and size are adapted to a specific product and function, thus optimizing performance.

Prototype development with different methods

Additive manufacturing is particularly suitable for the rapid and flexible production of prototypes. The Multi-Jet Fusion (MJF) process offers a cost-effective option, often preferred for this reason. Even more accessible is Fused Deposition Modeling (FDM), considered the most affordable method for prototyping. It is easy to handle, the printing material is inexpensive, and the overall process is more cost-efficient compared to conventional methods. This allows for redesign and analysis in a shorter time.

Platforms like Xometry use algorithms and artificial intelligence to efficiently connect clients and manufacturers. These automated processes enable rapid processing and significantly shorten innovation cycles.

For applications with high precision and surface quality requirements, processes like Stereolithography (SLA) or Carbon DLS (Digital Light Synthesis) are suitable. These printing processes work with liquid plastics characterized by excellent surface quality, high flexibility, and water resistance—qualities that make them particularly valuable for modern electronic applications. They are also ideal for high-resolution prototypes and functional models where tight tolerances are crucial.

Less waste through 3D printing

Electronic products, like printed circuits, essentially rely on two types of materials: an insulating dielectric substrate and conductive elements. Newer polymer materials with low dielectric constants and semiconducting polymer materials, both with adjustable electronic properties, are currently being adapted for printing. Such materials, combined with 3D printing, offer better opportunities for design and development.

A major advantage of 3D printing is that it generates less waste compared to conventional methods. In electronics, additional wiring and circuits are eliminated through 3D printing. Moreover, multiple work steps are reduced to a single one in printed electronics, which also simplifies assembly. Excess material is conventionally removed by etching with harmful chemicals, which is also unnecessary in additive manufacturing as the layer is placed directly in place without further steps. (heh)

Research

3D chips in high-rise architecture: MIT pushes the boundaries of semiconductor manufacturing

Link: Industrieller 3D-Druck von Xometry. (external link)