Precision and reliability with 3D measurement for solder joints and components

THT inspection Precision and reliability with 3D measurement for solder joints and components

2024-08-13 Source: Press release | Translated by AI 2 min Reading Time

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GÖPEL electronic offers a solution for the inspection of THT and SMD components, which achieves a significant improvement in error detection and a reduction in pseudo errors through a modern 3D camera module.

The THT Line 3D system from GÖPEL electronic offers, among other things, a state-of-the-art 3D camera module and reduces the pseudo error rate in measurements on THT solder joints.(Image: GÖPEL electronic) — The THT Line 3D system from GÖPEL electronic offers, among other things, a state-of-the-art 3D camera module and reduces the pseudo error rate in measurements on THT solder joints.
(Image: GÖPEL electronic)

The German company GÖPEL electronic is a specialist in flexible THT inspection systems. With the THT Line · 3D system, it takes the inspection of THT assemblies to a new level. The new innovation, a state-of-the-art 3D camera module, revolutionizes failure detection and simultaneously significantly reduces the false failure rate in measurements at critical THT soldering points. In addition, the testing time is significantly reduced. GÖPEL electronic is thus setting new standards in the double-sided, parallel inspection of THT assemblies.

A key component of this new development is the camera lens combination, which is characterized, among other things, by high-resolution image capture with simultaneous enlargement of the field of view (FOV) and additional reduction of the image capture time. In addition to the 3D measurement of THT pins and solder joints, this increased resolution also enables the inspection of SMD components up to a shape of 0201. This provides increased security, especially for selective soldering, through the inspection of adjacent SMD components.

Camera module in focus

Furthermore, this camera module is characterized by a telecentric optics with a measuring range of up to 35 mm, which is particularly advantageous when using different workpiece carriers in the production process. Since the circuit board level can fluctuate by several millimeters in relation to the transport level in such applications, this now poses no restrictions at all with the new camera module, both in the case of 3D measurements and 2D tests.

Another innovation of this camera module is the integration of a reflection reducer, which causes a significant increase in data quality in critical layout situations during 3D measurements on the solder side of the assembly. Particularly steep, highly reflective, and closely spaced solder joints can lead to reflections, which then result in erroneous height information in 3D measurements. This effect is physically based and occurs equally for the described situations in all 3D AOI systems. Although the data can be visually cleaned up by various interpolation methods, they may not correspond to reality. To avoid this, GÖPEL electronic has integrated a "Reflection Reducer" into the 3D camera module, which eliminates this disturbing effect in its creation and thus increases the reliability of the 3D measurement.

The THT Line · 3D enables the testing of THT components, THT solder joints, and SMD components in one system. The automatic or manual feeding of assemblies can be done both with and without a workpiece carrier. The PILOT AOI system software offers the user high user comfort and highest defect detection through different inspection methods. The MagicClick tool generates a production-ready test program including component library in a few minutes without any library entry. (sb)

Link: THT Line 3D from GÖPEL electronic

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Date: 08.12.2025

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