Lidrotec & Trumpf: Laser dicing makes wafers 3× faster

Wafer Dicing Laser Dicing Process Increases Speed and Yield

2026-03-04 Source: Press release by Trumpf | Translated by AI 1 min Reading Time

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According to their own statements, Lidrotec and Trumpf Accelerate Wafer Dicing in the Chip Industry.

The laser-assisted process is intended to make wafer cutting significantly more productive.(Image: Trumpf) — The laser-assisted process is intended to make wafer cutting significantly more productive.
(Image: Trumpf)

The high-tech company Lidrotec has developed an innovative laser dicing process. With its laser and beam shaping technology, Trumpf has helped to scale up the process for the mass production of wafers.

Users are said to be able to cut wafers three times faster than with conventional sawing processes while maintaining high cutting edge quality. "The new laser dicing process leaves the limits of established processes behind. It enables the chip industry to manufacture the next generation of semiconductors faster, more economically and in high quality," says Christian Weddeling, who is responsible for wafer dicing at Trumpf. Trumpf and Lidrotec are presenting the new technology at the Semicon Korea trade fair in Seoul.

Three Times Faster Than Mechanical Saws

The separation of semiconductor chips from a wafer is an important step in the backend of semiconductor production. The new process from Lidrotec combines ablative laser dicing under a liquid stream with high-precision beam forming technology from Trumpf. According to the press release, users benefit from a productivity gain as the cutting speeds are more than three times faster than those of mechanical saws. At the same time, the technology delivers the highest cutting edge quality, which corresponds to plasma dicing. The liquid immediately removes molten and solidified material residues. This reduces post-processing and increases the yield of defect-free chips.

Less Maintenance and Lower Operating Costs

As users do not require mechanical wear parts such as saw blades, both maintenance costs and operating costs are reduced compared to the sawing process, according to Trumpf. "Through the combination of speed, high yield of defect-free parts and reduced consumables, our technology helps to make semiconductor production more efficient and economical," says Alexander Kanitz, CTO of Lidrotec.

In addition, the process can be flexibly adapted to different materials such as silicon, silicon carbide or hybrid wafer structures and is therefore suitable for a wide range of semiconductor types.

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