mSAP and SAP technology Milestones in miniaturization in the electronics industry

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A look back in time shows an amazing development towards miniaturization—a time when size was not only a matter of scale, but also a sign of innovation.

In this development, technologies such as SAP (Semi-Additive Process) and mSAP (Modified Semi-Additive Process) play an important role. These methods have changed the manufacture of circuit boards and paved the way for ever more powerful and compact electronic devices. At the end of the review, we take a look at the latest development - the ultra-thin copper foil Nanotus, which opens a new chapter in the history of miniaturization. Dive with us into the world of macro dimensions and discover the possibilities of modern technology.

Challenges and hurdles of miniaturization

Despite the impressive advances in miniaturization, engineers and scientists face significant challenges. The smaller the components become, the more difficult it becomes to ensure their performance and reliability. One of the biggest hurdles is precision in the manufacture of tiny structures, which are often only a few nanometers in size. Production costs rise with increasing complexity, and the requirements for purity and material quality increase. In addition, thermal and electrical properties must be carefully controlled to avoid short circuits and overheating.

In this complex environment, every innovation requires not only technical know-how, but also creative problem solving and substantial investments in research and development. The balance between miniaturization and functionality remains a central challenge that necessitates constant adjustments and progress.

Innovations through miniaturization, mSAP and SAP technology

Miniaturization is a key driver of modern electronics. It enables more compact and powerful devices that are used in numerous applications from mobile phones to medical devices to high-performance computers. The ongoing reduction in component size means that more and more functions can be accommodated in smaller spaces, leading to more efficient and versatile products.

A crucial aspect here are technologies such as SAP (Semi-Additive Process) and mSAP (Modified Semi-Additive Process), which enable the manufacture of highly precise and dense conductor tracks. These technologies have expanded the boundaries of traditional PCB design (Printed Circuit Board) and open up entirely new possibilities for electronics development. In medicine, this leads to the development of innovative micro-implants and wearable diagnostic systems that are more precise and less invasive. In industrial automation and the Internet of Things (IoT), miniaturization enables networking of numerous devices and sensors, leading to better-connected systems.

The history of miniaturization

The history of miniaturization is a fascinating journey that goes far back and is closely linked to the development of electronics. Already in the early days of electronics there were efforts to reduce the size of components and thus increase the performance and efficiency of devices. An important milestone in this development was the introduction of integrated circuits in the 1950s and 1960s, which laid the foundation for modern miniaturization.

In the 1990s a standard for conductor track widths of 250 to 300 µm became established. At that time, it was a major challenge to manufacture these conductor tracks precisely and reliably. Widths of 50 µm could be realized, but this was associated with very high scrap rates, making production inefficient and costly. Nevertheless, the drive for ever smaller and more powerful components continued to drive innovation forward.

Today, just a few decades later, the standard has shifted significantly. Modern manufacturing technologies allow tracks widths of 125 µm to be made routinely and reliably. Even more impressive is the ability to produce tracks with widths of up to 10 µm—a scale that was unimaginable at the time. These advances are not only the result of technological innovations but also the result of intensive research and development.

The beginning of SAP and mSAP technology

The continuous miniaturization of components has not only significantly increased the performance of electronic devices, but has also laid the foundation for new applications and technologies that enrich our lives in many ways.

The development of SAP and mSAP technologies began in the late 1980s and early 1990s, as requirements for the miniaturization and performance of electronic devices steadily increased. Traditional manufacturing processes hit their limits, as they were unable to reliably produce the increasingly finer and more complex tracks. It became clear that new methods were needed to meet the rising requirements for precision and efficiency.

SAP, the "Semi-Additive Process", was developed to meet these challenges. It enables the manufacture of highly precise and dense conductor tracks and was a significant advancement in circuit board production. Over time, the mSAP method, the "Modified Semi-Additive Process", emerged as an advancement of SAP. MSAP offers even more flexibility and adaptability, as it uses the more versatile FR4 base material, as opposed to the SAP process, which is limited to base materials from the Ajinomoto company.

These technologies are crucial to meet the growing demand for more compact and powerful electronic devices. They allow the size of the conductor tracks to be further reduced, thus increasing the functionality and performance of the devices. Without the advances in SAP and mSAP technology, many of today's highly advanced electronic devices would not be possible.

Introduction and function of mSAP technology

The process of mSAP technology begins with the application of a thin layer of copper to the substrate. A photolithographic mask is then used to define the desired conductor track pattern. Electrolytic deposition is used to apply copper to the exposed areas of the mask to form the conductor tracks. After removing the mask, excess copper is etched away, leaving only the precisely defined conductor tracks.

This method allows for the production of conductor paths with widths and spacings in the range of a few micrometers, which is essential for the high density and precision of modern electronic circuits. The integration of an ultra-thin copper foil is crucial for the entire process.

Ultra-thin copper foil Nanotus

The ultra-thin Nanotus copper foil from YMT Co Ltd represents a breakthrough for MSAP and SAP technologies. Due to its extremely thin nature, this foil is particularly suitable for the production of ultrafine conductor tracks with the highest precision and efficiency. Nanotus is characterized by a special surface treatment that significantly improves adherence to the base materials. This improved adhesive property can be likened to a hook and loop fastener, which ensures a reliable connection. This allows for more precise placement and structuring of the conductor tracks, which in turn leads to higher quality and performance of the electronic components.

In addition, the low roughness of the Nanotus surface improves signal transmission and reduces signal losses, which is particularly advantageous for high-frequency applications. By reducing interference and signal losses, electronic devices and components made with Nanotus can offer higher performance and reliability. This underscores the versatility and innovative power of the Nanotus copper foil in modern technological applications.

Conclusion for the electronics industry

The advances in miniaturization and the ongoing development of MSAP technologies have fundamentally changed the electronics industry and opened up new perspectives for the design and manufacture of electronic devices. The introduction of the ultra-thin Nanotus copper foil represents a milestone in this development, as it offers significant advantages in terms of precision, density and performance of conductor tracks. These innovations will continue to drive the electronics industry forward and promote the development of ever smaller and more powerful devices. (mbf)

*Linda Lüüs is the executive assistant at RPtec GmbH.

This article was first published on our sister brand 'ELEKTRONIKPRAXIS' (German Edition), Vogel Communications Group