Technology Days Circuit Board 2025 UHDI PCBs: The Future of Miniaturization in Electronics Manufacturing

Related Vendors

NCAB Group Germany GmbH

FAULHABER Drive Systems

Wuxi InfiMotion Technology Co., Ltd.

UHDI PCBs enable the highest density with minimal space requirements and are key to the ever-advancing miniaturization in electronics manufacturing. In his presentation at the Technology Days Circuit Board 2025, Hüseyin Anaç discusses the manufacturing possibilities and future potential.

UHDI PCBs (Ultra High Density Interconnect) are advanced circuit boards specifically designed for the miniaturization of electronic products. This technology is increasingly in demand, especially in the field of consumer electronics, where more compact and powerful devices are required.

Compared to conventional circuit boards, UHDI PCBs offer a significantly higher density of electrical connections. With trace widths and component spacings below 50 µm and a dielectric thickness of less than 70 µm, the space requirement is minimized, enabling high integration density on a small area.

Application Areas of UHDI PCBs

UHDI PCBs are primarily required in areas where miniaturization and high performance are indispensable. They are used in smartphones, tablets, and wearables, as well as in medical devices, the automotive industry, aerospace, and IoT devices, all of which rely on compact and powerful electronics.

However, the production of these high-precision circuit boards is anything but simple. It requires advanced manufacturing technologies such as laser drilling machines and high-resolution photolithography. Additionally, thermal properties must be considered, as small traces generate higher heat levels. These challenges make production complex and cost-intensive.

Ultra-HDI PCBs—Everything You Need to Know

Hüseyin Anaç, Field Application Engineer at the NCAB Group, addresses the miniaturization trend in the electronics industry and the associated design requirements for UHDI PCBs in his presentation at the Technology Days Circuit Board on October 29 and 30, 2025.

Since 2024, the NCAB Group has been delivering UHDI PCBs in serial production and is actively working on the development of standards with IPC. The presentation provides a comprehensive introduction to UHDI designs, covers relevant processing technologies and design features, and offers an outlook on the market forecast from 2024 to 2028.

Your Forum for Knowledge And Exchange: Technology Days Circuit Board

Would you like to learn more about the future of Ultra-HDI PCBs? Then attend the lecture "Ultra HDI PCBs—Everything You Need to Know" at the . Mr. Anaç has already answered some interesting questions below and will be available for further answers at the event, which takes place simultaneously with the Developer Congress Power of Electronics and the Relay Technology User Forum.

Mr. Anaç, What Role do Additive And Semi-Additive Manufacturing Processes (SAP/mSAP) Play in the Implementation of UHDI Designs?

Additive and semi-additive manufacturing processes are crucial as they enable fine conductor structures below 50 µm. Unlike subtractive processes, where copper is etched away, SAP and mSAP apply copper precisely where it is needed. This results in higher precision, reduced material consumption (copper reduction > 90%), and lower energy usage (up to 70% less), which also improves the environmental footprint.

What Challenges Currently Exist in the Mass Production of UHDI PCBs in Europe?

The mass production of UHDI PCBs in Europe faces challenges such as high investment costs for specialized equipment (SAP/mSAP, laser drilling machines, ultra-thin dielectrics) and limited production capacities, as only a few facilities have the necessary infrastructure. UHDI also requires precise process controls and specialized know-how, making manufacturing cost-intensive. Additionally, the availability of materials such as ABF substrates is often limited.

What Does the Availability of Production Capacities for UHDI Look Like Worldwide—And What Developments Can Be Expected in the Coming Years?

Globally, a few factories, primarily in Asia, dominate the "Global Closed Market," producing exclusively for large customers. The "Global Free Market" is experiencing the strongest growth in UHDI production, as many factories are investing in the necessary capabilities. In the coming years, the area with conductor track widths of 50–40 µm will see significant growth, as these technologies can be realized with moderate investment. However, technologies for < 20 µm still require more time and investment. In Europe and the USA, the number of UHDI-capable factories remains low.

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