Manufacturing Research Fraunhofer is Working on A PFAS-Free Alternative for Etching Processes

Source: Press release | Translated by AI 1 min Reading Time

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Researchers at Fraunhofer ENAS are working on a new silicon structuring process that avoids fluorinated "forever chemicals." By curbing PFAS-containing process chemicals, the aim is to reduce environmental impacts in chip manufacturing.

Change in direction: The shift away from PFAS in semiconductor manufacturing and the move toward sustainable chip production is demonstrated by the trilateral collaboration between Fraunhofer ENAS, the Paul Scherrer Institute PSI, and Memsstar Limited, which rely on the environmentally friendly Gas-MacEtch technology.(Image: andreyarmyagov/Canva)
Change in direction: The shift away from PFAS in semiconductor manufacturing and the move toward sustainable chip production is demonstrated by the trilateral collaboration between Fraunhofer ENAS, the Paul Scherrer Institute PSI, and Memsstar Limited, which rely on the environmentally friendly Gas-MacEtch technology.
(Image: andreyarmyagov/Canva)

The Fraunhofer Institute for Electronic Nano Systems ENAS, together with the Paul Scherrer Institute (PSI) and the company Memsstar, is working on an alternative to PFAS-containing process chemicals in semiconductor manufacturing. The focus is on an innovative etching process for the micro- and nanotechnological processing of silicon, based on the so-called Gas-MacEtch technology. The use of environmentally friendly and biodegradable chemicals aims to significantly reduce the ecological impact during wafer structuring.

In addition to substituting fluorinated substances, the approach also addresses the energy consumption of manufacturing: According to the researchers, the process enables structuring at lower temperatures than established methods, reducing energy demand, greenhouse gas emissions, and production operating costs.

PFAS are considered indispensable in many industries due to their chemical stability and heat resistance, fulfilling central functions. At the same time, these substances are coming under increasing regulatory pressure because of their persistence and potential health risks. Against this backdrop, the development of alternative process chemistries for the semiconductor industry is gaining importance. Through this project, the partners aim to lay a foundation for transferring more sustainable manufacturing technologies into industrial practice and better meeting future environmental requirements.

What Does This Mean for the Industry?

PFAS are considered technically difficult to replace in many manufacturing steps, such as etching processes, sealing materials, or coatings, because they offer a combination of chemical stability, temperature resistance, and process reliability. The Fraunhofer consortium's approach thus addresses a key tension in the industry: the need to meet environmental requirements without compromising production capability.

Whether new processes achieve industrial relevance depends less on their fundamental functionality and more on criteria such as scalability, process integration, cost, and long-term stability. In practice, alternatives must not only replace individual applications but also be compatible with existing production lines. (sb)

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