Data Centers Flow Control Valves for Demanding Liquid Cooling Applications

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Modern high-performance data centers for computing generative AI applications rely on extremely energy-hungry chips that produce enormous amounts of waste heat. Conventional air cooling systems reach their limits here. Highly efficient liquid cooling systems that rely on robust miniature fluid control systems can meet the ever-increasing requirements. Lee has developed a valve that has been optimized for direct-to-chip cooling.

Generative AI applications require significantly higher chip densities and computing power than before. This has a massive impact on power consumption and the temperatures generated in these applications. According to a McKinsey study, AI data centers could account for ten percent of global electricity demand by 2030, due to the increased demand, but also due to increasingly powerful chips that generate many times more power consumption. One way to keep this cost and sustainability factor in check is to use more efficient chip cooling solutions. This is because cooling solutions consume around 30 percent of the energy required to operate data centers. In countries with high electricity prices, such as Germany, this can result in very high total operating costs.

Air Cooling Vs. Liquid Cooling

Air cooling systems are no longer an adequate solution for high-performance data centers. They cause enormous operating costs and are unable to keep the servers and chips within the temperature window in which optimum performance is possible. If the chips overheat, this initially leads to a loss of performance and, at critical temperatures, to a shutdown.

In view of high-performance chips with a power consumption of 1000 watts and more, innovative liquid or hybrid cooling systems are required. One option is immersion cooling systems, in which the computer is completely immersed in a cooling liquid. These systems deliver outstanding cooling performance—but are correspondingly expensive, both to purchase and, above all, in terms of complex maintenance. This drives up the total cost of ownership. Direct-to-chip liquid cooling systems are a more economical and hardly less powerful alternative. A welcome side effect of both solutions: Liquid cooling systems operate (almost) silently.

Dissipate Heat Directly at the Source

With direct-to-chip liquid cooling, cooling liquid is fed directly through cooling plates attached to the chips. The heat is therefore dissipated directly at the source. Compared to air-cooled solutions, the use of direct cooling makes it possible to create significantly more space-friendly systems with a higher packing density. At the same time, potential hotspots caused by uneven air cooling are avoided.

Developments in the data center market are clearly pointing towards higher performance and larger investments. Data center failures or even just individual servers due to leaks or inadequate cooling solutions cost operators an enormous amount of money. Our products have proven themselves in applications where nothing can go wrong.

Jürgen Prochno, Managing Director of the German subsidiary Lee Hydraulic Miniature Components

Fluid Control Components Critical to Success

Reliable and intelligent fluid control solutions are necessary for liquid-carrying systems so that they can work efficiently and safely. In a single-phase simple liquid cooling system, there is otherwise a risk that downstream chips will be insufficiently cooled. Overloading the cooling pump solution to compensate for this inadequate cooling must also be avoided. Uniform pressure, protection against contamination or compensation for system malfunctions, such as extreme overpressure due to a pump malfunction, are therefore among the central tasks of efficient fluid control components.

Adapt Intelligently to Requirements

To ensure that the pressure remains constant from the first to the last plate, pressure-compensated flow control valves are required that cover a wide low-pressure range and adapt intelligently to the requirements. The Lee Company has developed a robust and highly accurate solution for this. The QRV flow control valves are available in sizes from 0.22 to 0.71 inches and cover a flow rate of 0.05 to 5.3 GPM. Depending on the version, the pressure range is either between 0.1 and 2.75 bar (1.5 - 40 psi) or between 0.17 and 2 bar (2.5 - 30 psi). The stainless steel valves are designed to compensate for a flow delta of up to 15 percent and can therefore prevent the aforementioned problems such as chip overheating or pump overload.

Maximum Reliability for Mission-Critical Systems

For more than 75 years, The Lee Company has been manufacturing miniature pumps, valves, strainers, restrictors and closures for the most demanding applications. Lee's miniature components were used in the first moon landing, ensure efficiency and safe landings in airplanes or help to successfully heal people in medical and laboratory technology.

Lee has a comprehensive range of specialized machinery for the production of extremely small and lightweight components and the machining of the most demanding materials. In-house testing and inspection laboratories ensure compliance with demanding industry requirements and reduce time to market. The experienced Lee sales engineering team helps customers around the globe to successfully overcome the most demanding design challenges. All Lee products undergo 100 percent functional testing prior to shipment.

Increasingly Higher Performance in Data Centers

Jürgen Prochno, Managing Director of the German subsidiary Lee Hydraulische Miniaturkomponenten, explains: "Developments in the data center market are clearly pointing towards higher performance and greater investments. Data center failures or even single server failures due to leaks or inadequate cooling solutions cost operators an enormous amount of money. Our products have proven themselves in applications where nothing can go wrong. If, for example, the fuel system of a satellite launch vehicle fails, the costs are enormous. If braking systems in cars or landing systems in airplanes fail, it can be life-threatening. Our miniature components ensure that these cases do not occur. With us, manufacturers of liquid cooling systems for data centers have a new partner at their side who stands for maximum reliability, safety and performance."

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