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Electric Vehicles Compact SiC Power Modules With High Heat Dissipation for Onboard Chargers

Source: Press release | Translated by AI 2 min Reading Time

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Wuxi InfiMotion Technology Co., Ltd.

Rohm has developed new 4-in-1 and 6-in-1 SiC modules in HSDIP20 packages, optimized for PFC and LLC converters in onboard chargers for electric vehicles. The product line includes a total of 13 modules, six of which are for 750V and seven for 1200V. The manufacturer has integrated all necessary basic circuits for power conversion in various high-power applications into a compact module package.

Rohm has developed new high-power density SiC power modules, especially for use in OBCs.(Image: Rohm)
Rohm has developed new high-power density SiC power modules, especially for use in OBCs.
(Image: Rohm)

The increasing electrification of vehicles has driven automotive development in recent years. For electromobility to gain further traction, range plays an important role. To increase range and improve charging speed, higher battery voltages are used in electric vehicles. Onboard chargers (OBCs) and DC-DC converters thus need to become more powerful. At the same time, there is a growing demand for further miniaturization and weight reduction in these applications. This requires advancements to improve power density. Simultaneously, heat dissipation must be optimized, as otherwise it could hinder progress. Rohm's HSDIP20 package aims to address these technical challenges, which were previously difficult to manage with discrete configurations. It contributes to both enhancing performance and downsizing electric drivetrains.

Efficient thermal management

The HSDIP20 package features an insulating substrate with excellent heat dissipation properties, ensuring that the temperature rise of the chip is reduced even at high power. Comparing a typical OBC-PFC circuit with six discrete SiC MOSFETs with top-side heat dissipation to the Japanese manufacturer's 6-in-1 module, it is found that the HSDIP20 package is about 38°C cooler under the same conditions—at 25W operation. The efficient heat dissipation supports high currents even in a compact package and results in high power density.

Comparison of a typical OBC PFC circuit with six discrete SiC MOSFETs with top-side heat dissipation and Rohm's 6-in-1 module(Image: Rohm)
Comparison of a typical OBC PFC circuit with six discrete SiC MOSFETs with top-side heat dissipation and Rohm's 6-in-1 module
(Image: Rohm)

This is more than three times higher than in top-cooled discrete modules and more than 1.4 times higher than in similar DIP modules. In the PFC circuit, the HSDIP20 reduces the mounting area by approximately 52 percent compared to top-cooled discrete configurations, significantly contributing to downsized power converter circuits in applications such as OBCs.

Application Examples

Power converter circuits such as PFC and LLC converters are often used in the primary side circuits of industrial equipment. Thus, the HSDIP20 also supports the miniaturization of applications in industrial and consumer electronics.

  • Automotive systems: onboard chargers, electric compressors, and more.

  • Industrial applications: EV charging stations, V2X systems, AC servos, server power supplies, PV inverters, power conditioners, etc.

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