Image processing Wired with micrometer precision

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Wire bonding requires the utmost precision and forms the foundation for the production of high-performance electronics. To capture wire positions, F&S Bondtec Semiconductor uses IDS cameras for positioning and inspecting the finest wires.

Wire bonding is a central process in semiconductor production. It involves the use of extremely fine wires with diameters ranging from 15 to 75 micrometers to create tiny electrical connections between a semiconductor chip and other components. The distances between the bond wires are often less than 100 micrometers. Even the smallest deviation can lead to connection errors. For precise determination of wire positions and as part of quality assurance, F&S Bondtec Semiconductor GmbH from Braunau (Austria) relies on image processing technology with industrial cameras from IDS Imaging Development Systems GmbH in their wire bonders.

Wire bonders come with various degrees of automation. With manual devices, each bond position must be manually approached before the corresponding connections can be made. Semi-automatic machines automatically position the wire after the first bond to create a wire bridge. Fully automatic machines use a pattern recognition system to determine the position of the chips. Here, the production of all wire bridges is completely automatic. The worker only occasionally needs to change the wire or tool and handle loading and unloading.

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Image processing ensures "living" chips

Specifically with the semi-automatics of the 56i series and the automatic wire bonders of the 86 series, F&S Bondtec uses image processing with IDS industrial cameras for various manufacturing process tasks. "Our wire bonds connect previously placed microchips or other components with various contact points on circuit boards, bringing the chips to life. However, positional inaccuracies of the components can occur in the upstream processes. Our machines must detect these positional inaccuracies using the IDS camera image and our own image recognition software and accordingly update the wire bond positions," explains Johann Enthammer, Managing Director and CTO at F&S Bondtec.

For each bond process, parameters such as ultrasonic amplitude, force, time, or the motion sequence during the formation of the bond bridges must also be programmed in advance. The camera's live image is also used when creating these programs. For example, a wire can be drawn in the live image and its position changed. Additionally, the axes can be adjusted with a click in the image. The Austrian company relies on a self-developed image recognition library for software, which works with position/pixel mapping, grayscale recognition, and edge detection, for example.

Visual assessments of bond connections

After the bonding process is complete, the camera is used again, as Enthammer explains: "The wire bonds are visually inspected by the operator via the camera image after welding. Among other things, the position and shape of the bond loops are evaluated. Thus, the camera image has more than just one function during the bonding process."

Between one and seven industrial cameras are used per system. Depending on the system, these can be the particularly compact and affordable uEye XCP models. Measuring just 29 mm × 29 mm × 17 mm (approx. 1,1 inches × 1,1 inches × 0,7 inches), they are the smallest IDS housing cameras with C-mount and feature a completely enclosed zinc die-cast housing. Their screwable USB Micro-B connector and compatibility with the Vision Standard (U3V / GenICam) simplify integration.

F&S Bondtec also uses uEye CP cameras. These tiny powerhouses offer maximum functionality with extensive pixel preprocessing and are perfect for multi-camera systems, thanks to their internal 120 MB image memory for buffering image sequences. Users can choose from a wide range of modern CMOS sensors. They also score with a compact housing measuring only 29 mm × 29 mm × 29 mm (approx. 1,1 inches × 1,1 inches × 1,1 inches).

Criteria for camera selection

The compact design of the models and the large number of different sensors for C-mount lenses were important criteria for the camera selection, along with low heat generation. However, the free software development kit IDS peak, with all the programming interfaces and software tools necessary for operating and programming the cameras, was also crucial.

Easy-to-understand convenience features ensure an intuitive programming experience and quick and easy commissioning of the industrial cameras, as Johann Enthammer confirms: "The driver exhibits very stable runtime behavior. The easily programmable API and the plug-and-play functions with running software convinced us. This is because our systems have many different use cases, which can be implemented easily with the API. For example, our machines can be equipped with up to seven different bond heads. A different IDS camera can be integrated into each one."

A lot of potential for AI use

The wire bonders from F&S Bondtec ensure stable connections in semiconductor manufacturing. Integrated image processing can further enhance manufacturing quality and productivity, and prevent waste. At the same time, the cameras make the operators' work easier.

In addition to the standard products, the company develops special machines and custom software solutions, where AI models are also used. "For the future, we definitely see a lot of potential for the application of artificial intelligence in our applications," says Johann Enthammer. Especially in connection with AI, image processing opens up entirely new potential, particularly in terms of efficiency, precision, and quality. And thanks to IDS's broad portfolio, the right "eye" can be found for every application—for micrometer-accurate results. (mi)