The Differences Between Foil And Paste in Power Electronics

Thermal Interface Materials The Differences Between Foil And Paste in Power Electronics

2025-08-25 From Hendrik Härter | Translated by AI 2 min Reading Time

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Thermal interface materials are considered the unsung heroes of power electronics, says Dr. Schulz from Littelfuse. When they fail, they are the leading cause of malfunctions. A look at thermal interface materials in paste and foil form, as well as their weaknesses.

Failing thermal interface material is the main cause of malfunctions in power electronics. Dr. Martin Schulz from Littelfuse is giving a lecture on thermal interface material as a key component of thermal management.(Image: freely licensed / Pixabay) — Failing thermal interface material is the main cause of malfunctions in power electronics. Dr. Martin Schulz from Littelfuse is giving a lecture on thermal interface material as a key component of thermal management.
(Image: freely licensed / Pixabay)

Thermal interface materials are essential components in the thermal management of power electronics. At the Power of Electronics conference, taking place on October 29 and 30, our speaker Dr. Martin Schulz from Littelfuse will highlight the immense importance of these often invisible heroes. In his presentation, he will explain the failure mechanisms of traditional paste-like materials and how these can be avoided through modern films.

Schulz also explains why there is no universal solution, but rather different approaches are required depending on the application. Participants learn which physical principles and compatibility aspects are crucial to ensuring the reliability of power electronics.

Dr. Schulz, Why is the Topic of Your Lecture Particularly Relevant for Our Participants?

Thermal interface material is a key component of thermal management. Failing thermal material is the leading cause of power electronics failures. Traditional paste-like thermal materials exhibit failure mechanisms that can be avoided with films. The presentation highlights the differences and points out weaknesses in both systems that developers should be aware of before making a decision.

What Are the Three Key Aspects of Your Lecture?

Firstly, thermal interface materials are not just heat conductors; they are a multifunctional part of a structure and must function in thermal, mechanical, and chemical terms. Secondly, the compatibility between the thermal interface material, power semiconductor, and cooling system must be considered. And thirdly, what looks good at first glance or on a data sheet does not always work effectively. Tests within the individual setup are indispensable.

What Will Our Participants Learn in Your Lecture?

There is no 'one' solution, and depending on the application, different solutions may be the best option. However, there are physical principles that can serve as exclusion criteria. This simplifies the selection of a material or material group from the wide range of available solutions. (heh)

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Date: 08.12.2025

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