SK Hynix Invests Around 8 Billion US Dollars in EUV Systems from ASML

Expansion of Memory Production SK Hynix Invests Around 8 Billion US Dollars in EUV Systems from ASML

2026-03-24 From Susanne Braun | Translated by AI 1 min Reading Time

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SK Hynix is driving forward the expansion of its production capacities for AI memory and is investing around USD 8 billion in EUV lithography systems from ASML by 2027. The aim is to further scale the production of DRAM and high bandwidth memory (HBM).

NVIDIA's GB300 AI chip with HBM3E and HBM4 from SK Hynix.(Image: SK Hynix) — NVIDIA's GB300 AI chip with HBM3E and HBM4 from SK Hynix.
(Image: SK Hynix)

The sharp rise in demand for AI computing power is currently exacerbating the situation on the memory market. With the boom in AI applications, the demand for high bandwidth memory (HBM) is also growing, causing manufacturers to increasingly shift their production to higher-margin memory. At the same time, DRAM and NAND remain indispensable for numerous applications, which is leading to bottlenecks, rising prices and a tense supply situation.

Jensen Huang, CEO of Nvidia (left) and Tae-won Chey, Chairman of SK Group (right) together at the Nvidia event GTC 2026. (Image:SK Group)

With this in mind, SK Hynix has announced that it will purchase EUV equipment worth around 11.95 trillion won (approximately USD 8 billion) from ASML by the end of 2027, according to Trendforce, based on reports from Reuters. The investment is part of the company's strategy to expand its manufacturing capacity for next-generation storage technologies and to meet growing demand from the AI and data center sectors.

EUV As A Key Technology for AI Memory

EUV lithography plays a central role in the further development of modern DRAM generations. SK Hynix has been using the technology for several years and is continuously expanding its use. An increasing number of EUV layers is expected, particularly for future DRAM nodes and HBM generations.

At the same time, the company is working on the integration of high-NA-EUV systems, which enable a higher resolution and therefore smaller structures. These systems are regarded as the next evolutionary step in lithography and are intended to support the development of more powerful and energy-efficient memory chips.

The expansion of EUV capacities is not only a technological decision, but also a strategic one. By integrating new lithography systems at an early stage, SK Hynix aims to strengthen its competitive position in the global memory market and hold its own against other manufacturers such as Samsung and Micron. (sb)

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