Cooperation Siemens and TSMC Strengthen Alliance for Advanced Semiconductor Design

Source: Siemens | Translated by AI 1 min Reading Time

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The companies aim to not only strengthen their portfolio through collaboration but also enable their joint customers to master the challenges of tomorrow.

The cooperation is intended to enable advanced silicon stack and packaging design.(Image: Siemens)
The cooperation is intended to enable advanced silicon stack and packaging design.
(Image: Siemens)

Siemens Digital Industries Software has deepened its long-standing collaboration with TSMC to further drive innovations in semiconductor design and integration. According to a statement, the focus is on new certifications for Siemens EDA tools—including Calibre nmDRC, nmLVS, YieldEnhancer, and PERC—for TSMC's advanced N2P and A16 processes. The Analog FastSPICE (AFS) platform and Solido have also been validated for these nodes and are part of the official Customer Design Reference Flow (CDRF). This provides customers with a comprehensive signoff flow for advanced analog, mixed-signal, and memory designs.

Particularly relevant for industrial applications: The Calibre 3DSTACK solution has been certified for TSMC's 3DFabric technologies and the 3Dblox standard. At the same time, both partners are working on the integration of AFS and Calibre technologies into TSMC's optical COUPE platforms.

Cloud-based workflows are also coming into focus: Seven Siemens tools have been certified for production-ready signoff processes in the AWS cloud. The cooperation also extends to the development of future A14 technology, thereby strengthening the technological foundation for AI, automotive, hyperscale, and mobile applications.

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