Siemens and TSMC Intensify Partnership for the Next Semiconductor Generation

Certifications for New Process Nodes and 3D Technologies Siemens and TSMC Intensify Partnership for the Next Semiconductor Generation

2025-05-02 From Sebastian Gerstl| Translated by AI 2 min Reading Time

Siemens Digital Industries Software and TSMC have announced that they are expanding their cooperation with a focus on cutting-edge process and packaging technologies. New certifications are intended to better support customers in the development of future-proof semiconductor designs.

Siemens Digital Industries Software and TSMC are deepening their collaboration to promote further innovations in semiconductor design and integration.(Image: Siemens Digital Industries Software) — Siemens Digital Industries Software and TSMC are deepening their collaboration to promote further innovations in semiconductor design and integration.
(Image: Siemens Digital Industries Software)

Siemens Digital Industries Software is further expanding its long-standing partnership with semiconductor manufacturer TSMC. The goal is to drive innovations in semiconductor design and integration. The focus is on new certifications for Siemens EDA solutions in connection with TSMC's most advanced process nodes.

Certifications for N2P, A16, and 3DFabric Technologies

Siemens' Calibre nmPlatform software, including tools like nmDRC, nmLVS, YieldEnhancer, and PERC, has been certified for TSMC's N2P and A16 processes. The Calibre 3DSTACK solution also now meets the requirements of TSMC's 3DFabric technology and the 3Dblox standard, representing a significant step toward efficient silicon stacking and packaging design.

Focus on Mixed-Signal and High-Frequency Designs

In the field of analog and mixed-signal designs, Siemens' Analog FastSPICE (AFS) and Solido Design Environment received the necessary approval for use with TSMC's latest technologies. These support, among other things, simulation-based analyses of aging and self-heating in ICs, which are crucial for reliable use in demanding applications like automotive and AI.

Seven Siemens EDA solutions have been certified for production sign-off processes in the AWS cloud, offering customers more flexibility with the highest accuracy. Additionally, both companies are already working on the next process generations, including A14 and the COUPE photonics platform.

Commitment Also for Future Collaboration

By expanding joint developments, Siemens and TSMC intend to strengthen their offerings in the Open Innovation Platform ecosystem. Customers are expected to benefit from closer integration of powerful software solutions with cutting-edge manufacturing technologies, which should give them a decisive advantage in international competition.

"While we continue to pioneer and redefine possibilities within the semiconductor industry, our strategic alliance with TSMC remains a cornerstone of our strategy," stated Mike Ellow, CEO of Siemens EDA, Siemens Digital Industries Software. "These advancements not only expand our portfolio but also empower our joint customers to tackle the challenges of tomorrow."

"By strengthening our partnership with Siemens, TSMC promotes customer innovation by combining the excellence of Siemens' proven design solutions with the performance and energy efficiency benefits of TSMC's cutting-edge technologies," notes Lipen Yuan, Senior Director of Advanced Technology Business Development at TSMC. "Our collaboration with ecosystem partner companies in the Open Innovation Platform (OIP) like Siemens is crucial for us to continually push the boundaries of what is possible in semiconductor technology." (sg)

Subscribe to the newsletter now

Don't Miss out on Our Best Content

Business E-mail

Please enter a valid mailadress.

By clicking on „Subscribe to Newsletter“ I agree to the processing and use of my data according to the consent form (please expand for details) and accept the Terms of Use. For more information, please see our Privacy Policy. The consent declaration relates, among other things, to the sending of editorial newsletters by email and to data matching for marketing purposes with selected advertising partners (e.g., LinkedIn, Google, Meta)

Date: 08.12.2025

Naturally, we always handle your personal data responsibly. Any personal data we receive from you is processed in accordance with applicable data protection legislation. For detailed information please see our privacy policy.

Consent to the use of data for promotional purposes

I hereby consent to Vogel Communications Group GmbH & Co. KG, Max-Planck-Str. 7-9, 97082 Würzburg including any affiliated companies according to §§ 15 et seq. AktG (hereafter: Vogel Communications Group) using my e-mail address to send editorial newsletters. A list of all affiliated companies can be found here

Newsletter content may include all products and services of any companies mentioned above, including for example specialist journals and books, events and fairs as well as event-related products and services, print and digital media offers and services such as additional (editorial) newsletters, raffles, lead campaigns, market research both online and offline, specialist webportals and e-learning offers. In case my personal telephone number has also been collected, it may be used for offers of aforementioned products, for services of the companies mentioned above, and market research purposes.

Additionally, my consent also includes the processing of my email address and telephone number for data matching for marketing purposes with select advertising partners such as LinkedIn, Google, and Meta. For this, Vogel Communications Group may transmit said data in hashed form to the advertising partners who then use said data to determine whether I am also a member of the mentioned advertising partner portals. Vogel Communications Group uses this feature for the purposes of re-targeting (up-selling, cross-selling, and customer loyalty), generating so-called look-alike audiences for acquisition of new customers, and as basis for exclusion for on-going advertising campaigns. Further information can be found in section “data matching for marketing purposes”.

In case I access protected data on Internet portals of Vogel Communications Group including any affiliated companies according to §§ 15 et seq. AktG, I need to provide further data in order to register for the access to such content. In return for this free access to editorial content, my data may be used in accordance with this consent for the purposes stated here. This does not apply to data matching for marketing purposes.

Right of revocation

I understand that I can revoke my consent at will. My revocation does not change the lawfulness of data processing that was conducted based on my consent leading up to my revocation. One option to declare my revocation is to use the contact form found at https://contact.vogel.de. In case I no longer wish to receive certain newsletters, I have subscribed to, I can also click on the unsubscribe link included at the end of a newsletter. Further information regarding my right of revocation and the implementation of it as well as the consequences of my revocation can be found in the data protection declaration, section editorial newsletter.