Insights into electronic components Scanning ultrasound microscopy allows for error-free analysis

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Non-destructive insights into the interior of microelectronic components are possible with a scanning ultrasound microscope. This allows errors to be tracked down. The analysis is combined with machine learning and human expertise.

Who doesn't dream of the ultimate flawless component. Defects and errors in components can occur during production. The question is: can these be recognized in time? Early failure of the component in use can be the consequence if it is not detected in time. Depending on the application, this can have minor to catastrophic effects.

Computer-aided imaging methods are of great importance for modern non-destructive error analysis, such as in power electronics or microelectronics. Ultrasound, as used in medicine, shows great potential for non-destructively viewing the interior of microelectronic components. This is made possible with the Scanning Acoustic Microscope (SAM) from PVA TePla Analytical Systems.

Since 2012, the German company has been working on joint scientific projects with the Austrian research center Materials Center Leoben (MCL), which specializes in materials, manufacturing and processing processes, and innovative materials applications. At the initiative of Dr. Roland Brunner (MCL) and Dr. Peter Czurratis (Managing Director PVA TePla Analytical Systems), this has developed into a close cooperation.

High-end microscope offers resolutions up to 0.5 µm

The cooperation is intended to deepen and a reference laboratory with the scanning ultrasonic microscope SAM 302 HD² is to be set up at the MCL. The laboratory will be headed by Dr. Tatjana Djuric-Rissner from Graz. "The new high-end microscope is characterized by a novel stimulation electronics developed by PVA for frequencies up to 1.000 MHz. This is the highest frequency in the world for high-resolution acoustic imaging and analysis. With this, resolutions up to 0.5 µm can be achieved on suitable samples.

In addition, a Dynamic Through Scan with frequencies up to 100 MHz is possible, which allows high resolution even in transmission measurements," says Dr. Tatjana Djuric-Rissner, delighted about the current joint research project with the MCL.

The aim here is to further develop the scanning ultrasound microscope SAM 302 HD² for microelectronics and power electronics. Previous analyses of the images were mainly based on human expertise. However, the volumes of data generated are becoming increasingly larger and more complex.

Machine learning and human expertise

"The application of artificial intelligence (machine learning) in combination with human expertise can bring added value to error analysis," explains Dr. Roland Brunner from MCL. This is made possible by fully automatic error localization and classification, which in turn contributes to more sustainability and efficiency in the industrial production of micro and power electronics.

Dr. Peter Czurratis is also convinced of this and emphasizes: "Measurement technology, in particular ultrasonic microscopy as a non-destructive analysis method, will play a crucial role in quality assurance in the development of 3D manufacturing technologies for microelectronics in the coming years. In particular, hybrid bonding requires non-destructive defect analysis of the bonding interface using high-resolution ultrasonic microscopy. The MCL offers excellent scientific opportunities for the joint development of new algorithms for data analysis and will help us progress faster in terms of methodology." (heh)