New chip supplier, country's most advanced foundry

New chip supplier, country's most advanced foundry JV PSMC and Tata: Fresh Momentum for India's Semiconductor Ambitions

2024-10-14 From Sebastian Gerstl | Translated by AI 1 min Reading Time

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By 2027, the first products are expected to roll off the production line. These plans align with India's ambitions to become an alternative to China in the field of affordable electronics manufacturing.

"Made in India": India's largest engineering conglomerate, Larsen & Toubro, is investing $300 million to establish a new local fabless chip manufacturer.(Image: Pixabay (Montage: Sebastian Gerstl)) — "Made in India": India's largest engineering conglomerate, Larsen & Toubro, is investing $300 million to establish a new local fabless chip manufacturer.
(Image: Pixabay (Montage: Sebastian Gerstl))

Larsen & Toubro, India's largest engineering company, plans to invest more than 300 million US dollars in establishing a local fabless semiconductor manufacturer. According to Sandeep Kumar, the designated CEO of L&T Semiconductor, the company aims to develop 15 of its own semiconductor products by the end of the year and start selling them by the end of 2027. The Indian company targets product categories such as automotive, power ICs, high-frequency semiconductors, and integrated mixed-signal circuits.

This announcement aligns with India's economic plans to position itself as an alternative to China for the production of affordable electronic products. Just in March of this year, the Indian government made a significant investment of 1.26 trillion rupees (15.2 billion US dollars) in local electronics production, which includes the construction of the country's most advanced semiconductor factory. This facility aims to establish a local foundry, a packaging, and a testing facility, and is expected to commence operations within this year. The plant—a joint venture between the Taiwanese foundry specialist Powerchip Semiconductor (PSMC) and the local Indian company Tata Electronics—will be designed to produce 28-, 40-, 55-, and 110-nanometer chips and is expected to be able to produce up to 50,000 wafers per month. (sg)

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