Integration of inductors into the housing Industry's smallest 6-A power modules

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The power modules with MagPack technology are 50 percent smaller and double the power density with good thermal performance. The power modules reduce electromagnetic interference by 8 dB compared to previous types and at the same time improve efficiency by up to 2 percent.

Texas Instruments has introduced six new power modules that increase both power density and efficiency while reducing electromagnetic interference (EMI). The power modules use proprietary MagPack technology (integrated magnetic packaging technology), where inductive components are integrated into the housing, reducing their size by up to 23% compared to competing modules.

Three of the six building blocks—the TPSM82866A, TPSM82866C and TPSM82816 types—are according to the manufacturer the smallest 6-A power modules in the industry. They have a power density of nearly 1 A/mm².

Gallery

Gallery with 5 images

Power density is given as output current per unit area. With 2.3 mm by 3 mm, the TPSM82866A and the TPSM82866C have an area of 6.9 mm². This results in a power density per area of 0.87 A/mm². Almost 1 A per 1 mm² area is exceptional, especially considering that a 1608 component occupies a PCB area of 1.28 mm². The standard PCB design of the Evaluation Module (EVM) with simple design rules and large passive components results in a total size of 28 mm² for a complete 6-A power supply.

The TPSM82816 module offers features such as adjustable soft start, adjustable switching frequency, clock synchronization and adjustable control loop compensation in a slightly larger housing of 2.5 mm x 3 mm. The additional features require additional pins and passive components, increasing the total size of the solution to 46 mm². This is still very small for a 6-A power supply and provides a power density of 0.8 A/mm².

In addition to reducing the housing size and higher power density, it is important to effectively dissipate heat from the smaller housing. The inductance used in MagPack technology is matched to the silicon chip to reduce both DC and AC losses. The combination of these two circuit elements with the highly conductive MagPack housing helps to efficiently dissipate heat from the power module.

The semiconductor chip now has an optimized inductance and an optimized housing that ensures high efficiency and a low temperature rise. Image 1 shows the efficiency of the TPSM82866A, while Image 2 shows the Safe Operating Area (SOA).

The modules reduce interference radiation (EMI) as they are fully shielded. The entire chip, the inductance, the switching node is housed in a shielded case. In addition, the optimized trace routing within the housing allows for shorter, smaller traces for noisy signals, both within the power module and the system. Pictures 3 and 4 compare the radiation emissions of the TPSM82866A without and with MagPack technology. The peak emissions are reduced by about 2 dB in the horizontal arrangement and by 8 dB in the vertical.

"Developers use power modules to save time and space as well as to reduce complexity and the number of components, but these advantages have previously required a compromise in terms of performance," explains Jeff Morroni, Director of Power Management Research and Development in the Kilby Labs at TI.

"After nearly a decade of development, 'Integrated Magnetic Packaging' enables power circuit developers to embrace the key trend in the power sector that has shaped our industry: more power in less space—and in an efficient and cost-effective way.

More power with less space requirement

Size matters in the development of power electronics. Power modules simplify the design of power circuits and save valuable space on the PCB by combining a power chip with a transformer or inductor in one housing. By using the exclusive 3D housing encapsulation process, the MagPack housing technology maximizes the height, width, and depth of the power modules.

Magnetic Packaging uses an integrated power inductance with proprietary, newly developed material. As a result, engineers can now achieve the best power density in their class and reduce the temperature and interference emissions, while simultaneously minimizing both the space requirement on the circuit board and the power losses of the system.

These advantages are particularly important in applications such as data centers, where electrical energy is the largest cost factor. Some analysts predict that the demand for electrical energy will double by the end of this decade.

Pre-series quantities and Eva modules are available.(kr)